Fujitsu PRIMERGY GX2570 M8s (Air-Cooled) vs Inventec P9000AG7 (AC)
Both are built on the NVIDIA HGX B200 8-GPU baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | Fujitsu PRIMERGY GX2570 M8s (Air-Cooled) | Inventec P9000AG7 (AC) |
|---|---|---|
| Vendor | Fujitsu | Inventec |
| Part number | GX2570 M8s | P9000AG7 (AC) |
| Form factor | rack | rack |
| Released | — | — |
| Accelerator | 8x B200 | 8x B200 |
| Aggregate memory | 1.4 TB | — |
| Aggregate bandwidth | — | — |
| System power | — | — |
| Interconnect | One NVIDIA HGX B200 8-GPU baseboard with NVSwitch interconnecting the eight B200 SXM modules; two 10GbE RJ45 ports on an Intel X710, with Ethernet and InfiniBand cards optional | One NVIDIA HGX B200 air-cooled baseboard; eight low-profile PCIe Gen5 x16 slots hang off the switch, with one further full-height slot or an OCP 3.0 SFF from the mainboard |
Rows shown in grey are identical between the two.
Fujitsu PRIMERGY GX2570 M8s (Air-Cooled)
The air-cooled member of Fujitsu's PRIMERGY GX2570 M8s pair, sold by Fsas Technologies, the renamed Fujitsu server business. A 10U chassis carries one NVIDIA HGX B200 8-GPU baseboard holding eight B200 SXM modules at 180 GB apiece, interconnected by NVSwitch, for 1.44 TB of GPU memory. Hosting is two Intel Xeon 6900P processors reaching 128 cores and 256 threads, with 24 DIMM slots taking up to 6 TB of DDR5 at 6400 MT/s or MRDIMM at 8800. Storage is ten hot-plug 2.5 inch NVMe bays plus two internal M.2, and expansion is two full-height half-length and ten low-profile PCIe 5.0 x16 slots. The machine measures 449 by 843.3 by 438.8 mm and weighs up to 133 kg with rails, drawing from six 5,250 W Titanium supplies in 3+3 redundancy. Fujitsu publishes no throughput figure and no system power draw; performance figures for the baseboard are on the linked HGX B200 entry.
Vendor product pageInventec P9000AG7 (AC)
Inventec's air-cooled Blackwell node on AMD hosts, a 10U chassis 448 by 441 by 850 mm carrying one NVIDIA HGX B200 baseboard alongside fifth-generation AMD EPYC processors of up to 400 W. Storage is eight U.2 NVMe bays from the PCIe switch plus four more from the CPU and two M.2, and the switch also provides eight low-profile PCIe Gen5 x16 slots. Cooling is air, with fifteen 80 mm fans on the GPU side and five on the CPU side, and power comes from 3,300 W 54 V supplies in 4+2 redundancy for the accelerators with a separate 2,400 W 12 V plane in 1+1 for the host. Inventec publishes no throughput, memory or system power figure for the node; the baseboard's figures are on the linked HGX B200 entry. The GPU count is not stated on the page either, and is taken from NVIDIA's designation of HGX B200 as an eight-GPU baseboard.
Vendor product page