HPE Compute XD690 vs Inventec P9000G7 (AC)
Both are built on the NVIDIA HGX B300 8-GPU baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | HPE Compute XD690 | Inventec P9000G7 (AC) |
|---|---|---|
| Vendor | HPE | Inventec |
| Part number | S6G97A | P9000G7 (AC) |
| Form factor | rack | rack |
| Released | 2025 | — |
| Accelerator | 8x B300 | 8x B300 |
| Aggregate memory | 2.1 TB | — |
| Aggregate bandwidth | 64.0 TB/s | — |
| System power | 14.3 kW | — |
| Interconnect | NVLink 5.0 / NVSwitch 4.0 across the HGX B300 baseboard; 8x NVIDIA ConnectX-8 for InfiniBand XDR or Spectrum-X Ethernet scale-out | One NVIDIA HGX B300 air-cooled baseboard, with eight 800Gb OSFP connectors for east-west traffic |
Rows shown in grey are identical between the two.
HPE Compute XD690
A 10U air-cooled single-node chassis carrying eight NVIDIA Blackwell Ultra SXM6 GPUs on the HGX B300 baseboard, which HPE names directly in the orderable part S6A37A. Two Intel Xeon 6 processors with P-cores drive it, either the 6776P or the 6767P, both 64-core at 350 W, with up to 32 DDR5 DIMMs and a minimum system memory of 2,048 GB running at 5,200 MT/s in the two-DIMM-per-channel configuration HPE recommends for performance. Scale-out is eight ConnectX-8 adapters supporting InfiniBand XDR or Spectrum-X Ethernet, with storage of eight E1.S drives and two M.2. Power comes from twelve fixed 3,200 W Titanium supplies in an N+N redundant arrangement, and HPE rates the machine at 14.3 kW continuous and 16.4 kW peak. Air cooling a Blackwell Ultra system of this density is unusual and it shows in the mechanicals: the chassis weighs 226 kg, ships pre-racked by default, and HPE requires a server lift on site before its engineers will service it. HPE describes it as delivering 50 percent higher FP4 performance than the prior Blackwell generation but publishes no FLOPS figure of its own, so the compute shown is NVIDIA's specification for the HGX B300 board rather than an HPE claim.
Vendor product pageInventec P9000G7 (AC)
The Blackwell Ultra generation of Inventec's 10U air-cooled node, in the same 448 by 441 by 850 mm chassis as its B200 sibling but hosted by Intel Xeon 6700 series with E-cores or 6700 and 6500 series with P-cores. It carries one NVIDIA HGX B300 baseboard and eight 800Gb OSFP connectors for east-west networking, one per accelerator. Storage is eight U.2 NVMe bays with four optional more and two M.2. The accelerator power plane moves to 3,300 W supplies in 5+1 redundancy, tighter than the B200 node's 4+2, with a 2,000 W 12 V host plane. Inventec publishes no throughput, memory or system power figure; the linked HGX B300 entry carries NVIDIA's. The GPU count is not stated and is taken from NVIDIA's designation of HGX B300 as an eight-GPU baseboard.
Vendor product page