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Inventec P9000G7 (AC)

rack
8× B300
One NVIDIA HGX B300 air-cooled baseboard, with eight 800Gb OSFP connectors for east-west traffic
FP64
10
TFLOPS
FP32
600
TFLOPS
Power
—
kW Total
Memory
—
GB Total

The Blackwell Ultra generation of Inventec's 10U air-cooled node, in the same 448 by 441 by 850 mm chassis as its B200 sibling but hosted by Intel Xeon 6700 series with E-cores or 6700 and 6500 series with P-cores. It carries one NVIDIA HGX B300 baseboard and eight 800Gb OSFP connectors for east-west networking, one per accelerator. Storage is eight U.2 NVMe bays with four optional more and two M.2. The accelerator power plane moves to 3,300 W supplies in 5+1 redundancy, tighter than the B200 node's 4+2, with a 2,000 W 12 V host plane. Inventec publishes no throughput, memory or system power figure; the linked HGX B300 entry carries NVIDIA's. The GPU count is not stated and is taken from NVIDIA's designation of HGX B300 as an eight-GPU baseboard.

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FP64
10
TFLOPS
FP32
600
TFLOPS
TF32
9,000
TFLOPS
FP16
18,000
TFLOPS

System Details

GPU Configuration

GPU Count: 8 GPUs
Architecture: Blackwell Ultra
Interconnect: One NVIDIA HGX B300 air-cooled baseboard, with eight 800Gb OSFP connectors for east-west traffic

System Specifications

Form Factor: rack
Total Power: —
Total Memory: —
Memory Bandwidth: 64 TB/s

Precision Performance Breakdown

PrecisionSystem PerformancePer GPUEfficiency
10 TFLOPS 1.3 TFLOPS —
600 TFLOPS 75 TFLOPS —
9,000 TFLOPS 1,125 TFLOPS —
18,000 TFLOPS 2,250 TFLOPS —
18,000 TFLOPS 2,250 TFLOPS —
36,000 TFLOPS 4,500 TFLOPS —
108,000 TFLOPS 13,500 TFLOPS —
1,500 TOPS 188 TOPS —
FP6 36,000 TFLOPS 4,500 TFLOPS —

Where a vendor states a basis, the figure shown is the dense one, and any figure it publishes is listed separately. Vendors commonly headline the sparse number instead: for NVIDIA's 2:4 structured sparsity that is exactly twice the dense figure, though other vendors' sparse modes do not all follow that ratio.

Powered by NVIDIA B300

This system utilizes 8 × NVIDIA B300 SXM 262GB GPUs, each delivering exceptional performance for AI and HPC workloads.

Per GPU TDP

1400W

Per GPU Memory

263 GB

Process Node

4nm

Architecture

Blackwell Ultra

Documentation & Resources

Flopper Spec Sheet

Inventec P9000G7 (AC) specifications, generated from our database. Printable.

Vendor product page

Inventec P9000G7 (AC) documentation

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Inventec Artemis Rack

Inventec • Latest version

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Typical Use Cases

AI/ML Training
High-Performance Computing
Data Analytics

The Inventec P9000G7 (AC) runs 8× B300 GPUs over One NVIDIA HGX B300 air-cooled baseboard, with eight 800Gb OSFP connectors for east-west traffic, delivering 36,000 TFLOPS FP8 dense.

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