HPE Cray XD670 vs HPE ProLiant Compute XD685 (HGX H200)
Both are built on the NVIDIA HGX H200 baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | HPE Cray XD670 | HPE ProLiant Compute XD685 (HGX H200) |
|---|---|---|
| Vendor | HPE | HPE |
| Part number | — | — |
| Form factor | rack | rack |
| Released | 2024 | 2025 |
| Accelerator | 8x H200 | 8x H200 |
| Aggregate memory | 1.1 TB | 1.1 TB |
| Aggregate bandwidth | 38.4 TB/s | 38.4 TB/s |
| System power | — | — |
| Interconnect | NVIDIA NVLink with NVSwitch across the eight SXM modules | NVLink 4.0 / NVSwitch 3.0 across the HGX H200 baseboard; 4x FHHL PCIe Gen5 x16 slots for fabric, NIC or DPU |
Rows shown in grey are identical between the two.
HPE Cray XD670
A 5U server carrying eight NVIDIA H200 SXM GPUs at 700 W each with 141 GB of HBM3e apiece, driven by a single two-socket node of 5th generation Intel Xeon Scalable processors at up to 400 W, with 32 DDR5 DIMMs across eight channels per socket at up to 5,600 MHz. It is air cooled with a direct liquid cooling option. HPE has taken six first-place results with it in MLPerf Inference v5.1, including computer vision and LLM chat and text generation. Two things this row deliberately does not claim: HPE describes the GPUs only as "8x NVIDIA H200 SXM" and never names the HGX baseboard, though eight H200 SXM at 700 W is precisely the HGX H200 8-GPU configuration, and the compute figures shown are NVIDIA's for that baseboard rather than any HPE claim; and HPE publishes component TDPs but no system power figure, so total power is left blank rather than summing 8 x 700 W and 2 x 400 W, which would count silicon only and understate the machine. Part numbers are also not recorded, since none appears on HPE's page.
Vendor product pageHPE ProLiant Compute XD685 (HGX H200)
The eight-way XD685 in its NVIDIA HGX H200 configuration, the only one of the four HPE offers in both air-cooled and liquid-cooled form: 6U for air with accelerator kit S3P89A, 5U for direct liquid cooling with S4X53A. Two fifth-generation AMD EPYC processors drive it, from 32 to 96 cores and 280 to 400 W, across 24 DIMM slots with twelve channels per socket and up to 6 TB of DDR5-6400. Storage is eight EDSFF NVMe E3.S drives, or twelve with a storage controller, plus RAID-1 M.2 boot. No chassis part number is recorded because two apply depending on cooling, S4Q28A for air and S4R96A for liquid. HPE publishes no system power draw for the XD685, only twelve 3,000 W Titanium supplies with ten deployable, so nothing is summed here; the compute figures are NVIDIA's for the HGX H200 baseboard rather than an HPE claim.
Vendor product page