Enflame L600
Overview
The L600 is Enflame's fourth-generation accelerator and its first part aimed at training rather than inference. It is an OAM module carrying one 邃思 400 chip, rated at 700 W and built on the fourth generation of Enflame's own GCU-CARA compute unit, which the company describes as a deliberate refusal of the GPGPU model: its own instruction set, its own accelerated compute unit answering the Tensor Core, and its own GCU-LARE fabric answering NVLink. The generation's distinguishing feature is native FP8, which Enflame says makes it one of the few Chinese vendors supporting the datatype in hardware rather than by conversion. Up to 128 modules connect in a single-layer all-to-all topology, and Enflame builds two systems on it: OGX400, an eight-module node released in July 2025, and ESL32/64, a 32 or 64 module rack-scale superpod still waiting on volume production. Enflame publishes no throughput figure for the part, in any document. Its IPO prospectus prints power, FP16 throughput, memory type, capacity, bandwidth and interconnect bandwidth for six NVIDIA and AMD parts on one page, and gives the L600 a single merged cell reading only that it leads the domestic field for training and inference cards. As of the prospectus signing the chip had come back from fab but was not yet in volume delivery.
Performance
Peak theoretical throughput by precision type
| Precision | Peak |
|---|---|
FP64 | No verified data available |
FP32 | No verified data available |
TF32 | No verified data available |
BF16 | No verified data available |
FP16 | No verified data available |
FP8 8-bit floating point | No verified data available |
FP6 | No verified data available |
FP4 | No verified data available |
INT8 | No verified data available |
Flopper holds no verified throughput figures for this part yet. The rows stay so the gaps are visible.
Dense peak divided by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead. TDP for this part: 700 W.
Specifications
Architecture
GCU-CARA 4
Form Factor
OAM
Launch Year
2025
Process Node
No verified data available
Memory
144 GB
Bandwidth
No verified data available
TDP
700 W
Max power (Flopper estimate)
~805 W est. Flopper estimate: 700 W TDP x 1.15. The vendor publishes no maximum board power for this part.
Interconnect
GCU-LARE
Spec Confidence
Vendor claimed
Full Specifications
| Memory | |
|---|---|
| Memory | 144 GB |
| Memory Type | No verified data available |
| Bandwidth | No verified data available |
| Interface Width | No verified data available |
| Interconnect & I/O | |
| GPU-to-GPU | GCU-LARE |
| Power & Thermal | |
| TDP | 700 W |
| Max power (Flopper estimate) | ~805 W est. |
| Cooling | Air or liquid cooled |
| Enterprise Features | |
| Compute APIs | TopsRider |
| General | |
| Form Factor | OAM |
| Architecture | GCU-CARA 4 |
| Process Node | No verified data available |
| Launch Year | 2025 |
Datasheet & Resources
Data Provenance
Every figure traced to a source
Primary Source
- Publisher
- Enflame
- Published
- 2026-06-07
Data Quality
- Spec confidence
- Vendor claimed
- Clock basis
- Boost
- Core precisions with figures
- 0 of 9
- Normalization
- All values in TFLOPS
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Browse GPU Cloud ProvidersFrequently Asked Questions
How many TFLOPS does the Enflame L600 have?
Flopper does not currently have any verified throughput figures for the Enflame L600.
What is the power consumption of the Enflame L600?
The Enflame L600 has a TDP (Thermal Design Power) rating of 700 watts.
How much memory does the Enflame L600 have?
The Enflame L600 is equipped with 144 GB of memory. Flopper does not currently have a verified memory bandwidth figure for it.
What architecture is the Enflame L600 based on?
The Enflame L600 is based on the GCU-CARA 4 architecture, launched in 2025.
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