Enflame publishes no throughput figure for this part in any document that can be read. Its IPO prospectus contains a full technical comparison table which prints power, FP8 support, FP16 throughput, memory type, memory capacity, memory bandwidth and interconnect bandwidth for the NVIDIA A100, H20, H100 and H200 and the AMD MI300X and MI250X, and then gives its own S60 and L600 one merged cell each saying only that they lead the domestic field. Nothing from that table belongs to this row, and the coincidence that the H100 and H200 rows also read 700 W is just a coincidence. The memory capacity of 144 GB is divided from Enflame's own system totals rather than stated: the OGX400 node holds eight of these modules and 1.15 TB, and the ESL superpod holds 64 and 9.2 TB, which both come to about 144 GB a module. Two figures reported widely from the WAIC 2025 launch are deliberately not stored, 3.6 TB/s of memory bandwidth and 800 GB/s of interconnect bandwidth: neither is in the filing, and enflame-tech.com is behind a Tencent firewall that refuses every request, so neither can be checked against anything Enflame itself wrote. They should be added when that site becomes readable. As of the prospectus signing in June 2026 the chip had returned from fab and was not yet in volume delivery, which is also why only one datatype is listed below: FP8 is the only precision Enflame names for this generation.
EN

Enflame L600

Type: ASICArchitecture: GCU-CARA 4Form factor: OAMReleased: 2025Spec confidence: Vendor claimed
Memory
144 GB
TDP
700 W

Overview

The L600 is Enflame's fourth-generation accelerator and its first part aimed at training rather than inference. It is an OAM module carrying one 邃思 400 chip, rated at 700 W and built on the fourth generation of Enflame's own GCU-CARA compute unit, which the company describes as a deliberate refusal of the GPGPU model: its own instruction set, its own accelerated compute unit answering the Tensor Core, and its own GCU-LARE fabric answering NVLink. The generation's distinguishing feature is native FP8, which Enflame says makes it one of the few Chinese vendors supporting the datatype in hardware rather than by conversion. Up to 128 modules connect in a single-layer all-to-all topology, and Enflame builds two systems on it: OGX400, an eight-module node released in July 2025, and ESL32/64, a 32 or 64 module rack-scale superpod still waiting on volume production. Enflame publishes no throughput figure for the part, in any document. Its IPO prospectus prints power, FP16 throughput, memory type, capacity, bandwidth and interconnect bandwidth for six NVIDIA and AMD parts on one page, and gives the L600 a single merged cell reading only that it leads the domestic field for training and inference cards. As of the prospectus signing the chip had come back from fab but was not yet in volume delivery.

Performance

Peak theoretical throughput by precision type

PrecisionPeak
FP64
No verified data available
FP32
No verified data available
TF32
No verified data available
BF16
No verified data available
FP16
No verified data available
FP8
8-bit floating point
No verified data available
FP6
No verified data available
FP4
No verified data available
INT8
No verified data available

Flopper holds no verified throughput figures for this part yet. The rows stay so the gaps are visible.

Specifications

Architecture

GCU-CARA 4

Form Factor

OAM

Launch Year

2025

Process Node

No verified data available

Memory

144 GB

Bandwidth

No verified data available

TDP

700 W

Max power (Flopper estimate)

~805 W est. Flopper estimate: 700 W TDP x 1.15. The vendor publishes no maximum board power for this part.

Interconnect

GCU-LARE

Spec Confidence

Vendor claimed

Full Specifications

Memory
Memory 144 GB
Memory Type No verified data available
Bandwidth No verified data available
Interface Width No verified data available
Interconnect & I/O
GPU-to-GPU GCU-LARE
Power & Thermal
TDP 700 W
Max power (Flopper estimate) ~805 W est.
Cooling Air or liquid cooled
Enterprise Features
Compute APIs TopsRider
General
Form Factor OAM
Architecture GCU-CARA 4
Process Node No verified data available
Launch Year 2025

Datasheet & Resources

Data Provenance

Every figure traced to a source

Data Quality

Spec confidence
Vendor claimed
Clock basis
Boost
Core precisions with figures
0 of 9
Normalization
All values in TFLOPS

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Frequently Asked Questions

How many TFLOPS does the Enflame L600 have?

Flopper does not currently have any verified throughput figures for the Enflame L600.

What is the power consumption of the Enflame L600?

The Enflame L600 has a TDP (Thermal Design Power) rating of 700 watts.

How much memory does the Enflame L600 have?

The Enflame L600 is equipped with 144 GB of memory. Flopper does not currently have a verified memory bandwidth figure for it.

What architecture is the Enflame L600 based on?

The Enflame L600 is based on the GCU-CARA 4 architecture, launched in 2025.

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