MetaX 曦云C550 3D Mesh 超节点

cluster

64× C550

3D Mesh topology over low-cost, low-latency electrical interconnect with memory semantics, spanning up to eight chassis

MetaX's electrically interconnected supernode, built from standard OAM servers holding 曦云C550 modules and mainstream CPUs. A 3D Mesh topology over low-cost, low-latency electrical links joins up to eight chassis into a single 64-card domain with memory-semantic communication, which MetaX positions as the low-latency and lower-cost alternative to its optical C500X node. The 64 cards shown here are the maximum topology MetaX states rather than a fixed configuration. No power, memory total or throughput figure is published.