MX

MetaX 曦云C550 3D Mesh 超节点

cluster
64× C550
3D Mesh topology over low-cost, low-latency electrical interconnect with memory semantics, spanning up to eight chassis
Power
kW Total
Memory
4096
GB Total

MetaX's electrically interconnected supernode, built from standard OAM servers holding 曦云C550 modules and mainstream CPUs. A 3D Mesh topology over low-cost, low-latency electrical links joins up to eight chassis into a single 64-card domain with memory-semantic communication, which MetaX positions as the low-latency and lower-cost alternative to its optical C500X node. The 64 cards shown here are the maximum topology MetaX states rather than a fixed configuration. No power, memory total or throughput figure is published.

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System Details

GPU Configuration

GPU Model: MetaX C550
GPU Count: 64 GPUs
Architecture:
Interconnect: 3D Mesh topology over low-cost, low-latency electrical interconnect with memory semantics, spanning up to eight chassis

System Specifications

Form Factor: cluster
Total Power:
Total Memory: 4096 GB
Memory Bandwidth:

Powered by MetaX C550

This system utilizes 64 × MetaX C550 GPUs, each delivering exceptional performance for AI and HPC workloads.

Per GPU TDP

450W

Per GPU Memory

64 GB

Process Node

Architecture

Documentation & Resources

Official Datasheet

MetaX 曦云C550 3D Mesh 超节点 technical specifications

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MetaX (沐曦股份 688802) STAR Market IPO first-round inquiry response

MetaX • 2025-08-27

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Typical Use Cases

AI/ML Training
High-Performance Computing
Data Analytics

The MetaX 曦云C550 3D Mesh 超节点 runs 64× C550 GPUs over 3D Mesh topology over low-cost, low-latency electrical interconnect with memory semantics, spanning up to eight chassis.