Intel Gaudi 3 HL-338

Gaudi 3 PCIe 5nm
FP32
229.0
TFLOPS
VRAM
128 GB
HBM2E
TDP
600 W
381.7 TFLOPS/kW
Bandwidth
3.7 TB/s
memory
Tensor Processor Cores
64

Overview

The Intel Gaudi 3 HL-338 is the PCIe add-in-card form of Gaudi 3, putting the same 5nm processor as the HL-325L OAM mezzanine into a full-height dual-slot card 10.5 inches long at a 600 W card-level TDP, two thirds the OAM card's 900 W. It carries the same eight MME engines and 64 programmable Tensor Processor Cores, the same 128 GB of HBM2E at 3.7 TB/s and the same 96 MB of on-die L2, and connects to the host over PCIe 5.0 x16 at up to 128 GB/s. Intel positions it for inference and fine-tuning rather than large-scale training, and it is the variant that fits existing servers without an OAM baseboard. Scale-up is by top bridge rather than a baseboard: the HLTB-304A and HLTB-304B boards aggregate four cards into a quad at 900 GB/s per card, and Intel documents 2x4, 1x4 and 4x1 topologies, with two quads providing 512 GB of pooled HBM2E memory. Intel publishes no dense or sparse labelling for Gaudi 3 and no sparse figure; the matrix throughput figures come from Table 5 of Intel's technical paper, which footnotes them as projected maximums.

Performance Metrics

Peak theoretical throughput by precision type

PrecisionBitsPeak TFLOPSEfficiency
FP8 8 1678.0 2.797 TFLOPS/W
FP16 16 459.0 0.765 TFLOPS/W
BF16 16 1678.0 2.797 TFLOPS/W
TF32 32 459.0 0.765 TFLOPS/W
FP32 32 229.0 0.382 TFLOPS/W
FP8 Efficiency
2.797 TFLOPS/W
1678.0 TFLOPS / 600W
FP16 Efficiency
0.765 TFLOPS/W
459.0 TFLOPS / 600W
FP32 Efficiency
0.382 TFLOPS/W
229.0 TFLOPS / 600W

Power Specifications

TDP

600 W

Max Power

690 W

Power Connector

PCIe 16-pin

Cooling

Air

Memory Specifications

Capacity

128 GB

Type

HBM2E

Bandwidth

3700 GB/s

Interface

--

Hardware & Design

Form Factor

PCIe

Architecture

Gaudi 3

Process Node

5nm

Launch Year

--

Variant

HL-338

Market Segment

Data Center

Full Specifications

Compute Engine
Tensor Processor Cores 64
Memory
VRAM 128 GB
Memory Type HBM2E
Bandwidth 3.7 TB/s
Interconnect & I/O
GPU-to-GPU RoCE v2 RDMA over top bridge (HLTB-304A/304B), 900 GB/s per card in a 4-card quad
Interconnect Bandwidth 900 GB/s
PCIe Gen 5 x16
Cache
L2 Cache 96 MB
Power & Thermal
TDP 600 W
Physical & Media
Card Length 266.7 mm
Width 2-slot
General
Form Factor PCIe
Architecture Gaudi 3

Documentation & Resources

Common Use Cases

General Compute AI/ML Workloads Data Processing

The Intel Gaudi 3 is optimized for high-performance computing tasks with Gaudi 3 architecture delivering 229 TFLOPS of compute power.

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