Reference design, not a product for sale. AMD describes Helios as a blueprint for OEM and ODM partners to build their own branded systems on the Open Rack Wide standard, with partner deployments expected in the second half of 2026.

AMD Helios

rack
72× Instinct MI455X
UALink over Ethernet (UALoE) scale-up; Ultra Ethernet (UEC) scale-out; AMD Pensando DPUs
2026
FP8
1,450
PFLOPS
FP4
2,899
PFLOPS
Power
—
kW Total
Memory
31104
GB Total

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FP8
1,450
PFLOPS
FP4
2,899
PFLOPS

System Details

GPU Configuration

GPU Count: 72 GPUs
Architecture: CDNA 5
Interconnect: UALink over Ethernet (UALoE) scale-up; Ultra Ethernet (UEC) scale-out; AMD Pensando DPUs

System Specifications

Form Factor: rack
Total Power: —
Total Memory: 31.1 TB
Memory Bandwidth: 1.7 PB/s

Precision Performance Breakdown

PrecisionSystem PerformancePer GPUEfficiency
1,450 PFLOPS 20,133 TFLOPS —
2,899 PFLOPS 40,265 TFLOPS —

Where a vendor states a basis, the figure shown is the dense one, and any figure it publishes is listed separately. Vendors commonly headline the sparse number instead: for NVIDIA's 2:4 structured sparsity that is exactly twice the dense figure, though other vendors' sparse modes do not all follow that ratio.

Powered by AMD Instinct MI455X

This system utilizes 72 × AMD Instinct MI455X OAM GPUs, each delivering exceptional performance for AI and HPC workloads.

Per GPU TDP

—

Per GPU Memory

432 GB

Process Node

—

Architecture

CDNA 5

Documentation & Resources

Flopper Spec Sheet

AMD Helios specifications, generated from our database. Printable.

Vendor product page

AMD Helios documentation

View ↗

AMD Radeon RX 9070 GRE Product Specifications

AMD • 2026-05-31

View Document ↗

Typical Use Cases

AI/ML Training
High-Performance Computing
Data Analytics

The AMD Helios runs 72× Instinct MI455X GPUs over UALink over Ethernet (UALoE) scale-up; Ultra Ethernet (UEC) scale-out; AMD Pensando DPUs, delivering 1,450 PFLOPS FP8 dense.

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