Cerebras publishes no rack power figure for the CS-4, no rack height or weight, no clock speed and no Ethernet port count, so none is shown. The 750 PFLOPS headline is the vendor's own and is footnoted as sparse FP16, so it appears in the sparse column with no dense partner: Cerebras sparsity is unstructured, which means it cannot be halved the way a 2:4 structured figure can. The 2.8 GHz clock and the six 200 Gb Ethernet ports quoted in trade press coverage of this launch are that writer's explicitly stated guesses, not Cerebras figures, and are not recorded here. First shipments were stated as beginning in the third quarter of 2026.
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Cerebras CS-4

rack
3× WSE-3
Direct Wafer Links, switch-free, plus RoCE v2 RDMA over Ethernet; 7.2 Tbit/s system I/O; 160.5 PB/s on-wafer fabric
2026
FP16
750,000
TFLOPS sparse
Power
—
kW Total
Memory
—
GB Total

The Cerebras CS-4 is a rack built from three Wafer Scale Engine 3 Turbo processors, and the first system on the Cerebras Nexus platform. Each wafer is the same silicon as the WSE-3 in the CS-3, four trillion transistors across 46,225 mm2 on TSMC 5 nm with 900,000 AI cores and 44 GB of on-chip SRAM, run at roughly twice the throughput: 250 PFLOPS and 43.2 PB/s of memory bandwidth per wafer against 125 PFLOPS and 21 PB/s before it. Three of them give the rack 750 PFLOPS, 132 GB of SRAM and 129.6 PB/s of memory bandwidth, with no DRAM anywhere in the system. Cerebras gets the extra throughput from packaging rather than from new silicon: power conversion now sits 0.5 mm from the wafer instead of the roughly 50 mm of a conventional accelerator board, which nearly removes board-level loss and lets the rack push twice as much power into each wafer. Compute, power and I/O are separate modules, the wafer and its power conversion, liquid cooling, I/O and control electronics folded into a rear-mounted Wafer-Scale Backpack with half the component count of the previous generation. The new I/O module doubles bandwidth to 2.4 Tbit/s per wafer and runs two ways, standards-based RoCE v2 RDMA over Ethernet for mixed fleets and switch-free Direct Wafer Links between wafers, which brings wafer-to-wafer latency down to about two microseconds. Cerebras rates the rack at 750 PFLOPS but footnotes that figure as sparse FP16, and its sparsity is unstructured rather than 2:4 structured, so no dense equivalent can be derived by halving and none is published.

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FP16
750,000
TFLOPS sparse

System Details

GPU Configuration

GPU Model: Cerebras WSE-3
GPU Count: 3 GPUs
Architecture: Wafer Scale Engine 3
Interconnect: Direct Wafer Links, switch-free, plus RoCE v2 RDMA over Ethernet; 7.2 Tbit/s system I/O; 160.5 PB/s on-wafer fabric

System Specifications

Form Factor: rack
Total Power: —
Total Memory: —
On-die SRAM: 132 GB
Memory Bandwidth: 129.6 PB/s

Precision Performance Breakdown

PrecisionSystem PerformancePer GPUEfficiency
0 TFLOPS 0 TFLOPS —

Where a vendor states a basis, the figure shown is the dense one, and any figure it publishes is listed separately. Vendors commonly headline the sparse number instead: for NVIDIA's 2:4 structured sparsity that is exactly twice the dense figure, though other vendors' sparse modes do not all follow that ratio.

Powered by Cerebras WSE-3

This system utilizes 3 × Cerebras WSE-3 GPUs, each delivering exceptional performance for AI and HPC workloads.

Per GPU TDP

—

Per GPU Memory

—

Process Node

TSMC 5nm

Architecture

Wafer Scale Engine 3

Documentation & Resources

Flopper Spec Sheet

Cerebras CS-4 specifications, generated from our database. Printable.

Vendor product page

Cerebras CS-4 documentation

View ↗

Cerebras CS-4 datasheet

Cerebras • 2026-08-18

View Document ↗

Typical Use Cases

AI/ML Training
High-Performance Computing
Data Analytics

The Cerebras CS-4 runs 3× WSE-3 GPUs over Direct Wafer Links, switch-free, plus RoCE v2 RDMA over Ethernet; 7.2 Tbit/s system I/O; 160.5 PB/s on-wafer fabric, delivering 750,000 TFLOPS FP16 dense.

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