Huawei Atlas 350 NEW
Overview
The Huawei Atlas 350 is the accelerator card built on the Ascend 950PR processor, announced by Huawei VP Ma Haixu at Huawei China Partner Conference 2026 and formally on sale from 21 March 2026. It is the first Atlas card to break the long-running 300-series numbering, reflecting a new silicon generation rather than a refresh. The card is a de-rated bin of the 950PR chip rather than a straight repackaging: it carries 112 GB of HiBL 1.0 at 1.4 TB/s against the chip's 128 GB at 1.6 TB/s, exactly seven eighths of both, the signature of one memory stack fused off out of eight, and it delivers 1.56 PFLOPS of dense MXFP4 against the chip's 2 PFLOPS, a further shortfall that implies a clock or core bin on top. HiBL 1.0 is Huawei's own in-house high-bandwidth memory, developed as a lower-cost alternative to HBM3E and HBM4E and aimed at the prefill stage of inference and at recommendation workloads, which are compute-heavy and memory-light. Power is 600W, one and a half times the 400W of NVIDIA's H20, and capacity is 1.16 times the 96 GB H20, the comparison Huawei itself drew at launch. Seven Chinese server OEMs launched systems around the card, mounting up to eight of them in a 6U two-socket Kunpeng 920 chassis. Huawei has published no datasheet for the Atlas 350, no FP8 or FP16 figure, no process node and no transistor count, and its separate claim of 2.87 times the single-card compute of an H20 has no stated basis and cannot be reconciled with any published pair of numbers. The underlying silicon is catalogued separately on this site as the Ascend 950PR.
Performance Metrics
Peak theoretical throughput by precision type
| Precision | Bits | Peak TFLOPS | Efficiency |
|---|---|---|---|
| FP6 | -- | 804.0 | 1.340 TFLOPS/W |
| INT8 | 8 | 804.0 | 1.340 TFLOPS/W |
| FP8 | 8 | 804.0 | 1.340 TFLOPS/W |
| FP4 | 4 | 1561.0 | 2.602 TFLOPS/W |
| FP16 | 16 | 425.0 | 0.708 TFLOPS/W |
| BF16 | 16 | 425.0 | 0.708 TFLOPS/W |
Power Specifications
TDP
600 W
Max Power
690 W
Power Connector
PCIe 16-pin
Cooling
Air
Memory Specifications
Capacity
112 GB
Type
HiBL 1.0
Bandwidth
1400 GB/s
Interface
--
Hardware & Design
Form Factor
Custom
Architecture
Da Vinci v3
Process Node
--
Launch Year
2026
Variant
Standard
Market Segment
Professional
Full Specifications
| Memory | |
|---|---|
| VRAM | 112 GB |
| Memory Type | HiBL 1.0 |
| Bandwidth | 1.4 TB/s |
| Interconnect & I/O | |
| GPU-to-GPU | Unified Bus 2.0 |
| Power & Thermal | |
| TDP | 600 W |
| Enterprise Features | |
| Compute APIs | CANN, MindSpore, PyTorch (torch_npu), vLLM-Ascend |
| General | |
| Form Factor | Custom |
| Architecture | Da Vinci v3 |
| Launch Year | 2026 |
Documentation & Resources
Common Use Cases
The Huawei Atlas 350 is optimized for high-performance computing tasks with Da Vinci v3 architecture delivering high TFLOPS of compute power.
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