Kunlunxin R200
Overview
The Kunlunxin R200 is the 16 GB member of the company's second-generation XPU-R accelerator line, a full-height full-length dual-slot PCIe Gen4 x16 card built on 7nm. It delivers 256 TOPS of INT8, 128 TOPS of INT16, 128 TFLOPS of FP16 and 32 TFLOPS of FP32, with 16 GB of GDDR6 at 512 GB/s, ECC, passive cooling and a 150 W board power. Kunlunxin positions it for both inference and training, and the card carries substantial video capability alongside its tensor work: 108 streams of 1080p30 decode and 27 streams of 1080p30 encode. Kunlunxin labels none of these figures dense or sparse and publishes no sparse rate. Note that Kunlunxin's separate second-generation chip page lists INT32 at 128 TOPS but omits the floating-point rates entirely, while this card page omits INT32; only the card page's own table is recorded here.
Performance
Peak theoretical throughput by precision type
| Precision | Peak |
|---|---|
FP64 | No verified data available |
FP32 32-bit floating point | 32TFLOPS |
TF32 | No verified data available |
BF16 | No verified data available |
FP16 16-bit floating point | 128TFLOPS |
FP8 | No verified data available |
FP6 | No verified data available |
FP4 | No verified data available |
INT16 | 128TOPS |
INT8 8-bit integer | 256TOPS |
Dense peak divided by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead. TDP for this part: 150 W.
The R200 in the GPU landscape
Peak FP16 TFLOPS (dense) against TDP, single-GPU parts tracked by Flopper
Higher and further left is better: more half-precision throughput for less power.
Specifications
Architecture
XPU-R
Form Factor
PCIe
Launch Year
No verified data available
Process Node
7nm
Memory
16 GB GDDR6
Bandwidth
512 GB/s
TDP
150 W
Max power (Flopper estimate)
~173 W est. Flopper estimate: 150 W TDP x 1.15. The vendor publishes no maximum board power for this part.
Spec Confidence
Official
Full Specifications
| Memory | |
|---|---|
| Memory | 16 GB |
| Memory Type | GDDR6 |
| Bandwidth | 512 GB/s |
| Interface Width | No verified data available |
| Interconnect & I/O | |
| PCIe | 4.0 x16 |
| Power & Thermal | |
| TDP | 150 W |
| Max power (Flopper estimate) | ~173 W est. |
| Cooling | Passive |
| Enterprise Features | |
| ECC Memory | Yes |
| General | |
| Form Factor | PCIe |
| Architecture | XPU-R |
| Process Node | 7nm |
| Launch Year | No verified data available |
Datasheet & Resources
Data Provenance
Every figure traced to a source
Primary Source
- Publisher
- Kunlunxin
- Published
- No verified data available
Data Quality
- Spec confidence
- Official
- Clock basis
- Boost
- Core precisions with figures
- 3 of 9
- Normalization
- All values in TFLOPS
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Frequently Asked Questions
How many TFLOPS does the Kunlunxin R200 have?
The Kunlunxin R200 delivers 32 TFLOPS FP32 and 128 TFLOPS FP16 at peak. Flopper does not currently have a verified FP8 throughput figure for it.
What is the power consumption of the Kunlunxin R200?
The Kunlunxin R200 has a TDP (Thermal Design Power) rating of 150 watts.
How much memory does the Kunlunxin R200 have?
The Kunlunxin R200 is equipped with 16 GB of memory with 512 GB/s of memory bandwidth.
What architecture is the Kunlunxin R200 based on?
The Kunlunxin R200 is based on the XPU-R architecture. Flopper does not currently have a verified launch year for it.
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